"An Experimental Study on the Abrasive Machining Process of Electronic ..."

Lei Guo et al. (2019)

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DOI: 10.1109/ACCESS.2019.2917304

access: open

type: Journal Article

metadata version: 2024-02-05

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Lei Guo, Xinrong Zhang, Chul-Hee Lee, Ioan D. Marinescu, Yihe Zhang, Jizhuang Hui:
An Experimental Study on the Abrasive Machining Process of Electronic Substrate Material With A Novel Ultraviolet-Curable Resin Bond Diamond Lapping Plate. IEEE Access 7: 64375-64385 (2019)

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