"Research on Wiener Degradation Model and Failure Mechanism of Interconnect ..."

Jiayan Dong et al. (2021)

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DOI: 10.1109/ACCESS.2021.3106261

access: open

type: Journal Article

metadata version: 2021-09-01

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Jiayan Dong, Yingli Long, Xiaoxuan Jiao, Yifeng Huang:
Research on Wiener Degradation Model and Failure Mechanism of Interconnect Solder Joints Under Random Vibration Load. IEEE Access 9: 117444-117455 (2021)

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