"Coupled Thermo-Mechanical Analysis of 3D ICs Based on an Equivalent ..."

Zhiqiang Cheng et al. (2020)

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DOI: 10.1109/ACCESS.2020.2966789

access: open

type: Journal Article

metadata version: 2022-03-21

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Zhiqiang Cheng, Yingtao Ding, Ziyue Zhang, Mingrui Zhou, Zhiming Chen:
Coupled Thermo-Mechanical Analysis of 3D ICs Based on an Equivalent Modeling Methodology With Sub-Modeling. IEEE Access 8: 14146-14154 (2020)

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