"Investigation of Terahertz 3D EM Simulation on Device Modeling and A New ..."

Yapei Chen et al. (2018)

> Home

Details and statistics

DOI: 10.1109/ACCESS.2018.2865929

access: open

type: Journal Article

metadata version: 2021-07-07

- view
  - electronic edition via DOI (open access)
  authority control:
- export record
  dblp key:
  - journals/access/ChenZXSCLXX18
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/access/ChenZXSCLXX18
Yapei Chen, Yong Zhang, Yuehang Xu, Yan Sun, Wei Cheng, Haiyan Lu, Fei Xiao, Ruimin Xu:
Investigation of Terahertz 3D EM Simulation on Device Modeling and A New InP HBT Dispersive Inter-Electrode Impedance Extraction Method. IEEE Access 6: 45772-45781 (2018)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.