"Multi-Dimensional Integration and Packaging of Devices for ..."

Nazek El-Atab et al. (2020)

> Home

Details and statistics

DOI: 10.1109/WF-IOT48130.2020.9221305

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/wf-iot/El-AtabSAAASKH20
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/wf-iot/El-AtabSAAASKH20
Nazek El-Atab, Reema Suwaidan, Yara Alghamdi, Alhanouf Alhazzany, Reema Almansour, Sohail Faizan Shaikh, Sherjeel M. Khan, Muhammad Mustafa Hussain:
Multi-Dimensional Integration and Packaging of Devices for Internet-of-Things Applications. WF-IoT 2020: 1-6

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.