"Thermal Modeling and Management Challenges in Heterogenous Integration: ..."

Jaehyun Park et al. (2024)

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DOI: 10.1109/VTS60656.2024.10538578

access: closed

type: Conference or Workshop Paper

metadata version: 2024-10-06

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Jaehyun Park, Alish Kanani, Lukas Pfromm, Harsh Sharma, Parth Solanki, Eric Tervo, Janardhan Rao Doppa, Partha Pratim Pande, Ümit Y. Ogras:
Thermal Modeling and Management Challenges in Heterogenous Integration: 2.5D Chiplet Platforms and Beyond. VTS 2024: 1-4

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