"A High-Level Signal Integrity Fault Model and Test Methodology for Long ..."

Sunghoon Chun et al. (2009)

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DOI: 10.1109/VTS.2009.38

access: closed

type: Conference or Workshop Paper

metadata version: 2024-02-27

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Sunghoon Chun, YongJoon Kim, Taejin Kim, Sungho Kang:
A High-Level Signal Integrity Fault Model and Test Methodology for Long On-Chip Interconnections. VTS 2009: 152-157

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