"Integration and Characterization of High Thermal Conductivity Materials ..."

W.-Y. Woon et al. (2024)

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DOI: 10.1109/VLSITECHNOLOGYANDCIR46783.2024.10631511

access: closed

type: Conference or Workshop Paper

metadata version: 2024-10-17

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W.-Y. Woon, J.-H. Jhang, K.-K. Hu, C.-C. Shih, J.-F. Hsu, J.-P. Lin, Y. Wu, Anna Kasperovich, Mohamadali Malakoutian, R. Soman, J. Kim, H.-K. Wei, M. Nomura, S. Chowdhury, Szuya Sandy Liao:
Integration and Characterization of High Thermal Conductivity Materials for Heat Dissipation in Stacked Devices. VLSI Technology and Circuits 2024: 1-2

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