"Integration of Si-Interposer and High Density MIM Capacitor on 2.5D ..."

Christopher Pelto et al. (2024)

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DOI: 10.1109/VLSITECHNOLOGYANDCIR46783.2024.10631478

access: closed

type: Conference or Workshop Paper

metadata version: 2024-10-17

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Christopher Pelto, R. Aggarwal, R. Ahan, M. Armstrong, M. Bebek, M. Blount, S. Chowdhury, J. Chuah, C. Connor, T. DeBonis, B. Dhayal, A. Dougless, S. Gokhale, A. Jain, V. Javvaji, K. Kamisetty, G. Kim, J. Kpetehoto, C. Kuan, C. Lin, G. Liu, Y. Ma, G. Mcpherson, S. Mokler, Christopher Perini, R. Ramaswamy, Bernhard Sell, R. Subramaniam, James Waldemer, D. Wei, Y. Yang, Y. Yang, J. Yaung, B. Sabi, S. Natarajan:
Integration of Si-Interposer and High Density MIM Capacitor on 2.5D Foveros Face-to-Face Architecture. VLSI Technology and Circuits 2024: 1-2

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