"4-Layer Wafer on Wafer Stacking Demonstration with Face to Face/Face to ..."

C.-L. Lu et al. (2023)

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DOI: 10.23919/VLSITECHNOLOGYANDCIR57934.2023.10185308

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type: Conference or Workshop Paper

metadata version: 2024-01-11

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C.-L. Lu, C.-H. Chuang, C.-H. Huang, S.-C. Lin, Y.-H. Chang, W.-Y. Lai, M.-H. Chiu, Ming Han Liao, S.-Z. Chang:
4-Layer Wafer on Wafer Stacking Demonstration with Face to Face/Face to Back Stacked Flexibility Using Hybrid Bond/TSV-Middle for Various 3D Integration. VLSI Technology and Circuits 2023: 1-2

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