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"Beyond 10 μm Depth Ultra-High Speed Etch Process with 84% Lower ..."
Yoshihide Kihara et al. (2023)
- Yoshihide Kihara, Maju Tomura, Wataru Sakamoto, Masanobu Honda, Masayuki Kojima:
Beyond 10 μm Depth Ultra-High Speed Etch Process with 84% Lower Carbon Footprint for Memory Channel Hole of 3D NAND Flash over 400 Layers. VLSI Technology and Circuits 2023: 1-2
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