"High Density Embedded 3D Stackable Via RRAM in Advanced MCU Applications."

Yao-Hung Huang et al. (2023)

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DOI: 10.23919/VLSITECHNOLOGYANDCIR57934.2023.10185230

access: closed

type: Conference or Workshop Paper

metadata version: 2023-07-28

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Yao-Hung Huang, Yu-Cheng Hsieh, Yu-Cheng Lin, Yue-Der Chih, Eric Wang, Jonathan Chang, Ya-Chin King, Chrong Jung Lin:
High Density Embedded 3D Stackable Via RRAM in Advanced MCU Applications. VLSI Technology and Circuits 2023: 1-2

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