"Mitigating Line-Break Defectivity with a Sandwiched TiN or W Layer for ..."

Anshul Gupta et al. (2024)

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DOI: 10.1109/VLSITECHNOLOGYANDCIR46783.2024.10631400

access: closed

type: Conference or Workshop Paper

metadata version: 2024-10-17

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Anshul Gupta, Shreya Kundu, Stefan Decoster, K. Sah, G. Delie, B. Truijen, Davide Tierno, Giulio Marti, O. Varela Pedreira, B. Kenens, Y. Hermans, C. Adelmann, B. de Wachter, Ivan Ciofi, G. Murdoch, A. Cross, Seongho Park, Zsolt Tokei:
Mitigating Line-Break Defectivity with a Sandwiched TiN or W Layer for Metal Pitch 18 NM Aspect Ratio 6 Semi-Damascene Interconnects. VLSI Technology and Circuits 2024: 1-2

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