"Ultra High Power Cooling Solution for 3D-ICs."

C. J. Wu et al. (2021)

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DOI: 10.23919/VLSICIRCUITS52068.2021.9492489

access: closed

type: Conference or Workshop Paper

metadata version: 2021-08-02

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C. J. Wu, S. T. Hsiao, J. Y. Wang, W. H. Lin, C. W. Chang, T. L. Shao, C. H. Tung, Doug C. H. Yu:
Ultra High Power Cooling Solution for 3D-ICs. VLSI Circuits 2021: 1-2

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