"A cluster-based reliability- and thermal-aware 3D floorplanning using ..."

Ying-Jung Chen, Shanq-Jang Ruan (2015)

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DOI: 10.1109/VLSI-SOC.2015.7314442

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-24

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Ying-Jung Chen, Shanq-Jang Ruan:
A cluster-based reliability- and thermal-aware 3D floorplanning using redundant STSVs. VLSI-SoC 2015: 349-354

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