"Thermal modelling of 3D multicore systems in a flip-chip package."

Kameswar Rao Vaddina et al. (2010)

> Home

Details and statistics

DOI: 10.1109/SOCC.2010.5784700

access: closed

type: Conference or Workshop Paper

metadata version: 2017-09-16

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/socc/VaddinaMLP10
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/socc/VaddinaMLP10
Kameswar Rao Vaddina, Tamoghna Mitra, Pasi Liljeberg, Juha Plosila:
Thermal modelling of 3D multicore systems in a flip-chip package. SoCC 2010: 379-383

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.