"Improving ICs reliability with high speed thermal mapping."

Saverio Panarello et al. (2017)

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DOI: 10.1109/SMACD.2017.7981607

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-14

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Saverio Panarello, Claudia Triolo, F. Garesci, Salvatore Patanè, Giuseppina Billè, D. Patti, L. Burian, D. Gazzo, Sandor Petenyi, Calogero Ribellino:
Improving ICs reliability with high speed thermal mapping. SMACD 2017: 1-4

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