"Through-silicon-via-aware delay and power prediction model for buffered ..."

Daehyun Kim, Sung Kyu Lim (2010)

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DOI: 10.1145/1811100.1811108

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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Daehyun Kim, Sung Kyu Lim:
Through-silicon-via-aware delay and power prediction model for buffered interconnects in 3D ICs. SLIP 2010: 25-32

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