"Embedded on-chip reliability: it's a thermal challenge."

Jörg Henkel (2013)

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DOI: 10.1145/2463596.2488357

access: closed

type: Conference or Workshop Paper

metadata version: 2018-11-06

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Jörg Henkel:
Embedded on-chip reliability: it's a thermal challenge. M-SCOPES 2013: 1

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