"Chip-embedded Glass Interposer for 5G Applications."

Xingchen Li et al. (2023)

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DOI: 10.1109/RWS55624.2023.10046338

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-21

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Xingchen Li, Xiaofan Jia, Kyoung-sik Moon, Joon Woo Kim, Aadit Pandey, Anthony Chiu, Andrew Kenerson, Madhavan Swaminathan:
Chip-embedded Glass Interposer for 5G Applications. RWS 2023: 129-131

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