"Modeling and simulation of Electrostatic Adhesion for Wall Climbing Robot."

Keng Huat Koh, R. M. Kuppan Chetty, S. G. Ponnambalam (2011)

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DOI: 10.1109/ROBIO.2011.6181590

access: closed

type: Conference or Workshop Paper

metadata version: 2020-10-25

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Keng Huat Koh, R. M. Kuppan Chetty, S. G. Ponnambalam:
Modeling and simulation of Electrostatic Adhesion for Wall Climbing Robot. ROBIO 2011: 2031-2036

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