"4×112 Gbps/fiber CWDM VCSEL Arrays for Co-Packaged Interconnects."

Binhao Wang et al. (2020)

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DOI: —

access: closed

type: Conference or Workshop Paper

metadata version: 2020-05-18

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  dblp key:
  - conf/ofc/WangSRKMT30
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  - https://dblp.org/rec/conf/ofc/WangSRKMT30
Binhao Wang, Wayne V. Sorin, Paul Rosenberg, Lennie Kiyama, Sagi Mathai, Michael R. T. Tan:
4×112 Gbps/fiber CWDM VCSEL Arrays for Co-Packaged Interconnects. OFC 2020: 1-3

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