"A 25-Gbps × 4 ch, Low-Power Compact Wire-Bond-Free 3D-Stacked ..."

Toshiki Kishi et al. (2019)

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DOI: —

access: closed

type: Conference or Workshop Paper

metadata version: 2021-08-11

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  - https://dblp.org/rec/conf/ofc/KishiWSNKFNIKAN19
Toshiki Kishi, Hitoshi Wakita, Kota Shikama, Munehiko Nagatani, Shigeru Kanazawa, Takuro Fujii, Hidetaka Nishi, Hiroshi Ishikawa, Yuko Kawajiri, Atsushi Aratake, Hideyuki Nosaka, Hiroshi Fukuda, Shinji Matsuo:
A 25-Gbps × 4 ch, Low-Power Compact Wire-Bond-Free 3D-Stacked Transmitter Module with 1.3-μm LD-Array-on-Si for On-Board Optics. OFC 2019: 1-3

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