default search action
"3D-Integrated Multichip Module Transceiver for Terabit-Scale DWDM ..."
Stuart Daudlin et al. (2021)
- Stuart Daudlin, Anthony Rizzo, Nathan C. Abrams, Sunwoo Lee, Devesh Khilwani, Vaishnavi Murthy, James Robinson, Terence Collier, Alyosha C. Molnar, Keren Bergman:
3D-Integrated Multichip Module Transceiver for Terabit-Scale DWDM Interconnects. OFC 2021: 1-3
manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.