"Photonic packaging in high-throughput microelectronic assembly lines for ..."

Tymon Barwicz et al. (2015)

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DOI: 10.1364/OFC.2015.W3H.4

access: closed

type: Conference or Workshop Paper

metadata version: 2021-07-09

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Tymon Barwicz, Yoichi Taira, Ted W. Lichoulas, Nicolas Boyer, Hidetoshi Numata, Yves Martin, Jae-Woong Nah, Shotaro Takenobu, Alexander Janta-Polczynski, Eddie L. Kimbrell, Robert Leidy, Marwan Khater, Swetha Kamlapurkar, Sebastian Engelmann, Yurii A. Vlasov, Paul Fortier:
Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability. OFC 2015: 1-3

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