"Oscillation ring testing methodology of TSVs in 3D stacked ICs."

Shadi M. Harb, William R. Eisenstadt (2016)

> Home

Details and statistics

DOI: 10.1109/NORCHIP.2016.7792911

access: closed

type: Conference or Workshop Paper

metadata version: 2024-10-06

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/norchip/HarbE16
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/norchip/HarbE16
Shadi M. Harb, William R. Eisenstadt:
Oscillation ring testing methodology of TSVs in 3D stacked ICs. NORCAS 2016: 1-4

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.