"A Reconfigurable Power System-in-Package Module using GaN HEMTs and IC ..."

Van Ha Nguyen et al. (2022)

> Home

Details and statistics

DOI: 10.1109/NEWCAS52662.2022.9842234

access: closed

type: Conference or Workshop Paper

metadata version: 2024-05-07

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/newcas/NguyenANPCBC22
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/newcas/NguyenANPCBC22
Van Ha Nguyen, Nueraimaiti Aimaier, Gabriel Nobert, Tan Pham, Nicolas G. Constantin, Yves Blaquière, Glenn E. R. Cowan:
A Reconfigurable Power System-in-Package Module using GaN HEMTs and IC Bare Dies on LTCC Substrate: Design - Implementation - Experiment and Future Directions. NEWCAS 2022: 188-192

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.