"Benefits of three-dimensional circuit stacking for image sensors."

Fadoua Guezzi Messaoud et al. (2013)

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DOI: 10.1109/NEWCAS.2013.6573597

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-24

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Fadoua Guezzi Messaoud, Antoine Dupret, Arnaud Peizerat, Yves Blanchard:
Benefits of three-dimensional circuit stacking for image sensors. NEWCAS 2013: 1-4

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