"Investigations of silicon wafer bonding using thin Al and Sn films for ..."

Zhiyuan Zhu et al. (2013)

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DOI: 10.1109/NEMS.2013.6559703

access: closed

type: Conference or Workshop Paper

metadata version: 2019-10-19

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Zhiyuan Zhu, Shaonan Wang, Yichao Xu, Guanjiang Wang, Yudan Pi, Peiquan Wang, Yunhui Zhu, Xin Sun, Min Yu, Jing Chen, Min Miao, Yufeng Jin:
Investigations of silicon wafer bonding using thin Al and Sn films for heterogeneous integration. NEMS 2013: 155-158

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