"Annular-Encapsulation Packaging to Realize High-Performance MEMS Thermal ..."

Yizhou Ye et al. (2018)

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DOI: 10.1109/NEMS.2018.8557002

access: closed

type: Conference or Workshop Paper

metadata version: 2024-08-04

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Yizhou Ye, Zhenjun Wang, Zhenxiang Yi, Ming Qin, Qing-An Huang:
Annular-Encapsulation Packaging to Realize High-Performance MEMS Thermal Wind Sensor. NEMS 2018: 456-459

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