"A convenient wafer level bonding based on unpatterned BCB."

Lei Li et al. (2014)

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DOI: 10.1109/NEMS.2014.6908859

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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Lei Li, Kangfa Deng, Wen Xia, Ningli Zhu, Song Li, Weiguo Su, Wei Zhang:
A convenient wafer level bonding based on unpatterned BCB. NEMS 2014: 502-506

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