"Chip scale packaging with surface mountable solder ball terminals for ..."

Ahra Lee et al. (2009)

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DOI: 10.1109/NEMS.2009.5068655

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-23

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Ahra Lee, SangChul Lee, Sungsik Lee, Chang Han Je, Sunghae Jung, Myoung-Lae Lee, Gunn Hwang, Byoung-Gon Yu, Chang Auck Choi:
Chip scale packaging with surface mountable solder ball terminals for microsensors. NEMS 2009: 612-615

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