"Testing 3D stacked ICs for post-bond partial/complete stack."

Surajit Kumar Roy et al. (2012)

> Home

Details and statistics

DOI: 10.1109/MWSCAS.2012.6292072

access: closed

type: Conference or Workshop Paper

metadata version: 2020-06-15

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/mwscas/RoyRGR12
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/mwscas/RoyRGR12
Surajit Kumar Roy, Dona Roy, Chandan Giri, Hafizur Rahman:
Testing 3D stacked ICs for post-bond partial/complete stack. MWSCAS 2012: 522-525

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.