"Agile and Resilient Embedded Systems."

Michael Vai et al. (2021)

> Home

Details and statistics

DOI: 10.1109/MILCOM52596.2021.9653094

access: closed

type: Conference or Workshop Paper

metadata version: 2022-01-12

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/milcom/VaiWDLHKLECLKLS21
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/milcom/VaiWDLHKLECLKLS21
Michael Vai, David Whelihan, Kyle Denney, Robert Lychev, Jeffrey J. Hughes, Donato Kava, Alice Lee, Nick Evancich, Richard Clark, David Lide, Kyung Joon Kwak, Jason H. Li, Douglas Schafer, Michael Lynch, Kyle Tillotson, Wladimir Tirenin:
Agile and Resilient Embedded Systems. MILCOM 2021: 715-720

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.