"5G Physical Layer Resiliency Enhancements with NB-IoT Use Case Study."

Xiang Cheng et al. (2022)

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DOI: 10.1109/MILCOM55135.2022.10017487

access: closed

type: Conference or Workshop Paper

metadata version: 2024-01-23

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Xiang Cheng, Hanchao Yang, Daniel J. Jakubisin, Nishith D. Tripathi, Gus Anderson, A. K. Wang, Y. Yang, Jeffrey H. Reed:
5G Physical Layer Resiliency Enhancements with NB-IoT Use Case Study. MILCOM 2022: 379-384

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