"Development of Eddy Current Sensor for Measuring Thickness of Copper Wafer ..."

Eungchul Kim, Seungjun Oh, Taesung Kim (2021)

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DOI: 10.1109/METROIND4.0IOT51437.2021.9488478

access: closed

type: Conference or Workshop Paper

metadata version: 2021-08-02

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Eungchul Kim, Seungjun Oh, Taesung Kim:
Development of Eddy Current Sensor for Measuring Thickness of Copper Wafer in sub-Micron Scale. MetroInd4.0&IoT 2021: 83-87

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