"In-Mold Heat Radiating Simulation and Verification of In-Mold Electronics."

Li-Wei Yao et al. (2024)

> Home

Details and statistics

DOI: 10.1109/IV55156.2024.10588735

access: closed

type: Conference or Workshop Paper

metadata version: 2024-07-31

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/ivs/YaoLLWW24
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/ivs/YaoLLWW24
Li-Wei Yao, Yi-Rong Lin, Chun-Chun Lai, Hsiao-Fen Wei, Chung-Wei Wang:
In-Mold Heat Radiating Simulation and Verification of In-Mold Electronics. IV 2024: 3030-3034

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.