"Multi-Gigahertz Testing of Wafer-Level Packaged Devices."

A. M. Majid et al. (2006)

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DOI: 10.1109/TEST.2006.297669

access: closed

type: Conference or Workshop Paper

metadata version: 2024-10-06

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A. M. Majid, David C. Keezer, Jayasanker Jayabalan, Mihai Rotaru:
Multi-Gigahertz Testing of Wafer-Level Packaged Devices. ITC 2006: 1-10

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