"Efficient Built-In Self-Test Scheme for Inter-Die Interconnects of ..."

Yi-Chun Huang et al. (2024)

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DOI: 10.1109/ITC51657.2024.00034

access: closed

type: Conference or Workshop Paper

metadata version: 2024-12-10

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Yi-Chun Huang, Pei-Yun Lin, Jin-Fu Li, Hong-Siang Fu, Yung-Ping Lee:
Efficient Built-In Self-Test Scheme for Inter-Die Interconnects of Chiplet-Based Chips. ITC 2024: 149-156

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