"Handling Die-to-Die I/O Pads for 3DIC Interconnect Tests."

Sandeep Kumar Goel et al. (2024)

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DOI: 10.1109/ITC51657.2024.00018

access: closed

type: Conference or Workshop Paper

metadata version: 2024-12-10

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Sandeep Kumar Goel, Moiz Khan, Ankita Patidar, Frank Lee, Vuong Nguyen, Bharath Shankaranarayanan, Doo Kim, Manish Arora:
Handling Die-to-Die I/O Pads for 3DIC Interconnect Tests. ITC 2024: 51-55

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