"A Framework for TSV Based 3D-IC to Analyze Aging and TSV Thermo-Mechanical ..."

Raviteja P. Reddy, Amit Acharyya, S. Saqib Khursheed (2019)

> Home

Details and statistics

DOI: 10.1109/ITC-ASIA.2019.00034

access: closed

type: Conference or Workshop Paper

metadata version: 2019-11-12

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/itc-asia/ReddyAK19
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/itc-asia/ReddyAK19
Raviteja P. Reddy, Amit Acharyya, S. Saqib Khursheed:
A Framework for TSV Based 3D-IC to Analyze Aging and TSV Thermo-Mechanical Stress on Soft Errors. ITC-Asia 2019: 121-126

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.