"Improving FPGA Design with Monolithic 3D Integration Using High Dense ..."

Srivatsa Rangachar Srinivasa et al. (2017)

> Home

Details and statistics

DOI: 10.1109/ISVLSI.2017.31

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

- view
  authority control:
- export record
  dblp key:
  - conf/isvlsi/SrinivasaMCHLCG17
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/isvlsi/SrinivasaMCHLCG17
Srivatsa Rangachar Srinivasa, Karthik Mohan, Wei-Hao Chen, Kuo-Hsinag Hsu, Xueqing Li, Meng-Fan Chang, Sumeet Kumar Gupta, John Sampson, Vijaykrishnan Narayanan:
Improving FPGA Design with Monolithic 3D Integration Using High Dense Inter-Stack Via. ISVLSI 2017: 128-133

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.