"Skybridge-3D-CMOS: A Vertically-Composed Fine-Grained 3D CMOS Integrated ..."

Mingyu Li et al. (2016)

> Home

Details and statistics

DOI: 10.1109/ISVLSI.2016.56

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

- view
  authority control:
- export record
  dblp key:
  - conf/isvlsi/LiSRKBM16
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/isvlsi/LiSRKBM16
Mingyu Li, Jiajun Shi, Mostafizur Rahman, Santosh Khasanvis, Sachin Bhat, Csaba Andras Moritz:
Skybridge-3D-CMOS: A Vertically-Composed Fine-Grained 3D CMOS Integrated Circuit Technology. ISVLSI 2016: 403-408

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.