"Chip Scale Camera Module (CSCM) using Through-Silicon-Via (TSV)."

Hiroshi Yoshikawa et al. (2009)

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DOI: 10.1109/ISSCC.2009.4977515

access: closed

type: Conference or Workshop Paper

metadata version: 2020-04-06

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Hiroshi Yoshikawa, Atsuko Kawasaki, Tomoaki Iiduka, Yasushi Nishimura, Kazumasa Tanida, Kazutaka Akiyama, Masahiro Sekiguchi, Mie Matsuo, Satoru Fukuchi, Katsutomu Takahashi:
Chip Scale Camera Module (CSCM) using Through-Silicon-Via (TSV). ISSCC 2009: 476-477

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