"11.1 AMD InstinctTM MI300 Series Modular Chiplet Package - HPC and AI ..."

Alan Smith et al. (2024)

> Home

Details and statistics

DOI: 10.1109/ISSCC49657.2024.10454441

access: closed

type: Conference or Workshop Paper

metadata version: 2024-03-19

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/isscc/SmithCPSWHJKMM24
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/isscc/SmithCPSWHJKMM24
Alan Smith, Eric Chapman, Chintan Patel, Raja Swaminathan, John J. Wuu, Tyrone Huang, Wonjun Jung, Alexander Kaganov, Hugh McIntyre, Ramon Mangaser:
11.1 AMD InstinctTM MI300 Series Modular Chiplet Package - HPC and AI Accelerator for Exa-Class Systems. ISSCC 2024: 490-492

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.