"27.7 A 30.5mm3 fully packaged implantable device with duplex ..."

Ting Chia Chang et al. (2017)

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DOI: 10.1109/ISSCC.2017.7870460

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-17

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Ting Chia Chang, Max L. Wang, Jayant Charthad, Marcus J. Weber, Amin Arbabian:
27.7 A 30.5mm³ fully packaged implantable device with duplex ultrasonic data and power links achieving 95kb/s with <10^-4 BER at 8.5cm depth. ISSCC 2017: 460-461

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