"Reliability consideration with rectangle- and double-signal through ..."

Chih-han Hsu et al. (2013)

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DOI: 10.1109/ISQED.2013.6523628

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-25

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Chih-han Hsu, Shanq-Jang Ruan, Ying-Jung Chen, Tsang-Chi Kan:
Reliability consideration with rectangle- and double-signal through silicon vias insertion in 3D thermal-aware floorplanning. ISQED 2013: 316-321

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