"Developing through-silicon stacking process using 3-D CMOS imager as a ..."

Ding-Ming Kwai, Ka-Yi Yeh (2011)

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DOI: 10.1109/ISOCC.2011.6138662

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-26

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Ding-Ming Kwai, Ka-Yi Yeh:
Developing through-silicon stacking process using 3-D CMOS imager as a test vehicle. ISOCC 2011: 124-126

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