"Thermal-aware methodology for repeater insertion in low-power VLSI circuits."

Ja Chun Ku, Yehea I. Ismail (2007)

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DOI: 10.1145/1283780.1283799

access: closed

type: Conference or Workshop Paper

metadata version: 2018-11-06

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Ja Chun Ku, Yehea I. Ismail:
Thermal-aware methodology for repeater insertion in low-power VLSI circuits. ISLPED 2007: 86-91

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