"Tightly Linking 3D Via Allocation Towards Routing Optimization for ..."

Suwan Kim et al. (2022)

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DOI: 10.1145/3531437.3539714

access: closed

type: Conference or Workshop Paper

metadata version: 2024-12-11

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Suwan Kim, Sehyeon Chung, Taewhan Kim, Heechun Park:
Tightly Linking 3D Via Allocation Towards Routing Optimization for Monolithic 3D ICs. ISLPED 2022: 26:1-26:6

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